Silicon Austria Labs – Chips JU: High power impulse magnetron sputtering and inductively-coupled plasma etching (HiPIMS & ICP)

The aim of this procurement procedure was to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of two module chambers capable of high-power impulse magnetron sputtering and inductively coupled plasma surface preparation intended for the fabrication of various metal thin films, for Silicon Austria Labs GmbH.