BEOL etch platform

Its object is the supply and commissioning of a new BEOL Etch Cluster. • 300mm Dry Etch/Strip Platform containing 3 Process Modules as described below: • Metal Dry Etcher capable of Metal, Metal Oxides and various HM (Hard Mask) etches • Deep Si Etcher capable of TSV (Through-Silicon Via) • Dry Stripper or Asher with water vapor passivation capability These Process Modules are targeted for various BEOL Applications from legacy technology nodes up to N3 and beyond. The contract will be awarded based on the best quality-price ratio, the award criteria will be further detailed in the tender documents.